Infrared heating modules for fab

Wed, 01 Jul 2026 13:28:33 +0800

On the fab floor, photoresist bake isn’t about comfort—it’s a thermal budget you can’t afford to miss. A 0.5°C drift in soft bake or hard bake will pull critical dimension control and take yield with it. We built our infrared heating modules to keep that budget honest, cycle after cycle. We run short-wave infrared emitters through a sealed, quartz-dominated optical path. The result is fast, radiant heat with minimal thermal inertia. Across the active zone, wafer-level uniformity holds at ±0.1°C, and batch-to-batch repeatability stays within ±0.5°C. Setpoint stabilization happens in seconds, so the process window stays repeatable even when the line is moving. The module is cleanroom-ready—Class 1–100 compatible—and the low-particle design keeps particle counts from climbing during bake. Here’s why it matters in lithography: the bake step sets the photoresist profile. Stabilizing temperature right at the wafer surface cuts reflection notch sensitivity and improves CD uniformity. The same discipline carries over into wafer cleaning and drying support, where controlled, even heating reduces surface tension effects and helps prevent pattern collapse. Energy use drops because the emitters heat the target, not the whole chamber. Reliability comes down to uptime. The system runs 24/7 on predictable maintenance intervals, not surprise stops. What to watch on integration Emissivity varies across films and metal stacks, so temperature control has to be tuned to the stack itself, not just the tool. The module is compact, but you still need to respect thermal clearances and shielding—otherwise you’ll get parasitic heating on adjacent hardware. Plan a short commissioning run to lock the recipe in. Once it’s set, the process stays repeatable, predictable, and quiet.

Modules on Custom Infrared Heat Solutions

Infrared heating modules for fab