Electronics Manufacturing

Building a PCB Reflow Profile From Paste and Component Limits

September 10, 2026

Building a PCB Reflow Profile From Paste and Component Limits A valid profile must remain within the solder paste and alloy process window without exceeding the limit of any component or laminate. An example oven profile provides only a starting …

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Profiling an IR Reflow Oven After Maintenance or Lamp Changes

August 20, 2026

Profiling an IR Reflow Oven After Maintenance or Lamp Changes Work on a lamp, reflector, guard or window, fan, sensor or controller can change the delivered heat field. Use a series of release gates; a successful startup is only the first …

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Tuning Conveyor Speed and IR Zone Power Together

August 20, 2026

Tuning Conveyor Speed and IR Zone Power Together Conveyor speed determines the exposure time in each zone, while zone power changes the heat input. Adjusting either variable can alter the ramp, soak, peak and cooling behavior, so both must be tuned …

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Preheat Soak Reflow and Cooling What Each Phase Controls

August 20, 2026

Preheat, Soak, Reflow and Cooling: What Each Phase Controls Each phase serves a different purpose within a single temperature history. Its actual limits come from the paste, alloy, components and board rather than from the name of the phase.

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Finding the Hottest and Coolest Locations on a Mixed PCB

August 20, 2026

Finding the Hottest and Coolest Locations on a Mixed PCB Large copper areas, heat sinks and high-mass packages often heat slowly, while small dark bodies and exposed edges may heat quickly. The actual extremes depend on the board layout and oven …

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