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Building a PCB Reflow Profile From Paste and Component Limits
September 10, 2026
Building a PCB Reflow Profile From Paste and Component Limits A valid profile must remain within the solder paste and alloy process window without exceeding the limit of any component or laminate. An example oven profile provides only a starting …
Finding the Hottest and Coolest Locations on a Mixed PCB
August 20, 2026
Finding the Hottest and Coolest Locations on a Mixed PCB Large copper areas, heat sinks and high-mass packages often heat slowly, while small dark bodies and exposed edges may heat quickly. The actual extremes depend on the board layout and oven …