PCB

Building a PCB Reflow Profile From Paste and Component Limits

September 10, 2026

Building a PCB Reflow Profile From Paste and Component Limits A valid profile must remain within the solder paste and alloy process window without exceeding the limit of any component or laminate. An example oven profile provides only a starting …

Read More

Preheat Soak Reflow and Cooling What Each Phase Controls

August 20, 2026

Preheat, Soak, Reflow and Cooling: What Each Phase Controls Each phase serves a different purpose within a single temperature history. Its actual limits come from the paste, alloy, components and board rather than from the name of the phase.

Read More

Finding the Hottest and Coolest Locations on a Mixed PCB

August 20, 2026

Finding the Hottest and Coolest Locations on a Mixed PCB Large copper areas, heat sinks and high-mass packages often heat slowly, while small dark bodies and exposed edges may heat quickly. The actual extremes depend on the board layout and oven …

Read More